Project Objectives

  1. Virtual Prototype Specifications of 3D Servers: Prototype specification of a 3D stacked device utilizing the ARM® CortexTM -A9 processor and integrated DRAM
  2. Characterization of Mobile Cloud Applications: Characterizing the ovi.com Cloud applications for traditional incumbent server architectures and Cortex A9-based hardware systems, and providing feedback on memory, processor and hardware acceleration requirements for use in future data center platforms
  3. Scalable 3D  Architecture Specifications and  Power Management: Specifying the non-coherent and coherent 3D server architectures, and hardware accelerators, and techniques for implementing on-chip power management
  4. On-chip Hierarchies and Interconnects: Optimizing memory/cache hierarchies in the presense of on-chip DRAM, and exploring the use of scalable interconnection networks for performing scalable core-to-core and core-to-memory communication
  5. Reliability, Availability and Fault Tolerance: Investigating reliability/fault-tolerance/availability issues from core- and system-level perspectives including software and hardware mitigation techniques
  • EuroCloud Partners ARM Nokia imec EPFL University of Cyprus


email
Contact Us


© The Energy-conscious 3D Server-on-Chip for Green Cloud Services Project (Project No: 247779 "EuroCloud") of the European Commission’s FP7 ICT Initiative.